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Devcon Hp 250 Epoxy, 50 Ml, Dev-Pak, Straw - 1 per EA - 14315
Devcon Hp 250 Epoxy, 50 Ml, Dev-Pak, Straw - 1 per EA - 14315
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$35.35 USD
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$54.91 USD
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SKU: 230-14315-S
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- High-performance. 1 per EA gap-filling thixotropic paste for structural bonding applications.
- Superior toughness. impact and chemical resistant.
- Bonds metals. FRP/SMC composites. phenolics. stainless steel. aluminum. vinyl esters. nylon. PVC. PC. styrenics. wood. and rigid plastics.
- Excellent gap fill..
- Adhesive Tensile Shear=3.
- 200 psi.
- Applicable Materials=Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel.
- Applications=Multi-Purpose.
- Base Type=Epoxy.
- Capacity Volume [Nom]=50 mL.
- Chemical Compound=Epoxy.
- Color=Straw.
- Dielectric Strength=490 V/mil.
- Elongation [Nom]=25%.
- Fix Cure Time @ Temp.=6 h @ 72 °F.
- Full Cure Time @ Temp.=7 d @ 72 °F.
- Hardness [Nom]=78 Shore D.
- Height [Nom]=3 1/4 in.
- Length [Nom]=7 1/4 in.
- Material=Thixotropic Paste.
- Odor/Scent=Low.
- Packing Type=Dev-Pak?.
- Physical Form=Solid.
- Ratio=2:1.
- Resistance=Chlorinated Solvents; Kerosene; Moisture; Water; Weather.
- Temp.
- Range [Max]=250 °F.
- Temp.
- Range [Min]=-67 °F.
- Tensile Strength [Nom]=3.
- 200 psi.
- Type=Adhesive.
- Usage=Structural Bonding.
- Viscosity [Nom]=105000 cP.
- Width [Nom]=6 in.
- Working Time [Nom]=65 min.